TESCON PRIMER RP

Applications TESCON PRIMER RP® prepares substrates for greater adhesion. Primer for wood, OSB, plywood, fiberboard, brick, concrete, roofs, walls and floors to prepare the substrate for the adhesion of Pro Clima tapes and the adhesive CONTEGA HF/LINE. Advantages Time saving, no drying needed – Adhesion can occur directly after application to porous substrates Penetrates deep into substrates and reinforces it Free of solvents Living Building Challenge Compliant — Red List Free Quick drying Can be combined with all Pro Clima tapes and adhesives Substrates A primer for wood, OSB, plywood, fiberboard, brick, concrete, roofs, walls and floors Properties Material: Acrylic co-polymer Application Temperature: 15 F° to 113 F°, -10 C° to +45 C° Must be stored above 32 F°, 0 C° (frost free)