Tungsten (W) Sputtering Target

Tungsten (W) sputtering targets are made of high purity tungsten and are widely used in physical vapor deposition (PVD) processes for thin film deposition. Tungsten sputtering targets can be used for various applications, including the deposition of hard coatings, wear-resistant coatings, and electrical contacts. They are typically available in round or rectangular shapes and can be customized to meet specific requirements. The high purity of tungsten sputtering targets ensures uniform deposition and high film quality, making them an ideal choice for advanced applications in microelectronics, optics, and aerospace industries. Tungsten Sputtering Target Dimensions Circular Sputtering Targets Diameter 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21” Rectangular Sputtering Targets Width x Length 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20” Thickness 0.125”, 0.25” Tungsten Sputtering Target Applications Tungsten Sputtering Target is mainly used in the