AMTECH LF-4300 TF

AMTECH LF-4300 TF

Was $85.01 SAVE 41%
$50.00
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DOWNLOADS  Technical Data Sheet   Safety Data Sheet  PRODUCT INFO Product Highlights  REL0 flux classification Optimized for Lead-free and standard alloy systems  Wide process window Residue can be left on the board in most assemblies (not recommended for high impedance assemblies) Excellent wetting compatibility on most board finishes Low voiding, Including LGA REACH compliant Application 4300/LF-4300-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. 4300/LF-4300-TF may be used for BGA sphere attachment and reballing. 4300/LF-4300-TF is also designed to work on all flip chip bumping and chip scale packaging sites.   Compatible Alloys   Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 42Sn/58Bi 138 280 42Sn/57Bi/1Ag 138 280 96.5Sn/3.0Ag/0.5Cu 217-220 423-428 99.0Sn/0.3Ag/0.7Cu 217-221 423-430 96.5Sn/3.5Ag 221 430 99.3Sn/0.7Cu 227 441 95Sn/%sB 235-240 455-46

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$85.01 $50 (-$35.01)