28.350 Compact Wave Solder Machine

Versatility for Any Wave Soldering Application 28.350 can be configured with dual waves to accommodate through-hole, surface mount and mixed-technology assemblies. The chip wave can be deactivated through the user interface for non-SMT applications, although the addition of the oscillating wave option will allow the chip wave to aid in hole fill and bridge reduction for difficult-to-solder boards of all technologies. The standard maximum wave width of 350 mm (13.8") can be adjusted, relative to PCB dimensions, through the use of an optional wave reducer mechanism and helps to minimize dross formation. Board interval sensing for wave activation and an energy-saving standby mode also aid in dross reduction. The solder module is driven by two heavy-duty, transducer-controlled 1/4 HP motors to ensure precise, uniform wave heights. One titanium-alloy lead-free-ready solder pot with a 200 kg (440 lbs Approximate weight for lead free solder) capacity comes standard with the 28.350. The s