IPC-QRG-SMT-H Surface Mount Solder Joint Evaluation Training & Reference Guide - Download

Note: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User. Updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. Useful as a training aid in the classroom or on the shop floor, QRG-SMT contains computer generated color illustrations of Chip component, Gull Wing, J Lead, BTC and Area Array solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths. QRG-SMT-H also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of