E07800 - SEMI E78 - Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment

The purpose of this Guide is to minimize the negative impact on productivity caused by static charge and electric fields in semiconductor manufacturing equipment. It is a guide for establishing electrostatic compatibility of equipment used in semiconductor manufacturing. Electrostatic compatibility in the entire semiconductor factory is addressed in SEMI E129.   Electrostatic surface charge causes a number of undesirable effects in semiconductor manufacturing environments. Electrostatic discharge (ESD) damages both products and reticles. ESD events also cause electromagnetic interference (EMI), resulting in equipment malfunctions. Charged wafer and reticle surfaces attract particles (electrostatic attraction [ESA]) and increase the defect rate. Charge on products can also result in equipment malfunction or product breakage. Operating problems and additional product defects due to static charge can have a negative impact on the cost of ownership (COO) of semiconductor manufacturing