E12900 - SEMI E129 - Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility

The purpose of this Guide is to minimize the negative impact on productivity caused by static charge and electric fields in semiconductor manufacturing environments. It is a guide for establishing electrostatic compatibility in facilities used for semiconductor manufacturing. Electrostatic compatibility of production equipment is addressed in SEMI E78.   Electrostatic surface charge causes a number of undesirable effects in semiconductor manufacturing environments. Electrostatic discharge (ESD) damages both products and reticles. ESD events also cause electromagnetic interference (EMI), resulting in equipment malfunctions. Charged wafer and reticle surfaces attract airborne particles (electrostatic attraction [ESA]) and increase the defect rate. Charge on products can also result in equipment malfunction or product breakage. Operating problems and additional product defects due to static charge can have a negative impact on the cost of ownership (COO) of semiconductor manufacturing